Previously, Qingchun Semiconductor had customized SiC chips with core indicators that reached the international leading level for Xizhi Technology. The vehicle mounted power module that integrates the technologies of both parties has been provided for testing by multiple domestic and foreign car companies. Both parties will accelerate the development of power solutions with advanced SiC devices as the core, and jointly create world-class SiC power and power products.

Qingchun Semiconductor Chairman Zhang Qingchun stated that automotive power modules are one of the largest application areas for SiC chips, and Qingchun Semiconductor has also made preparations in terms of technology, reliability, and production capacity for chip integration. A more optimized SiC solution for new energy vehicles requires chip and module suppliers to establish closer cooperation at all stages. We are pleased to cooperate with Xizhi Technology, and both parties will fully leverage their respective technological and industrial advantages to jointly create high-performance, high reliability vehicle power products based on SiC chip technology that satisfy customers, and jointly promote technological innovation in electric vehicles.

Liu Bo, Chairman of Xizhi Technology, stated that Xizhi and Qingchun have been committed to the goal of "serving first-class customers, deepening technical cooperation, and creating excellent products" through effective and in-depth cooperation. Both parties will further leverage their complementary technological advantages to contribute to the leading position of electric drive and power supply products for international and domestic first-class automotive customers.

刘波（左）、张清纯（右）签约合影